Semiconductor structure with suppressed sti dishing effect at resistor region

ABSTRACT

A method includes forming a first isolation feature of a first width and a second isolation feature of a second width in a substrate, the first width being substantially greater than the second width; forming an implantation mask on the substrate, wherein the implantation mask covers the first isolation feature and exposes the second isolation feature; performing an ion implantation process to the substrate using the implantation mask; and thereafter performing an etching process to the substrate.

BACKGROUND

Polysilicon resistors have been incorporated in conventional integratedcircuit (IC) design. A high resistance (Hi-R) resistor is located on ashallow trench isolation (STI) structure. The size of the STI structureis defined by the design rule of the active regions. Accordingly, a STIstructure, defining the distance between the adjacent active regions,cannot be less than a certain dimension, such as 10×10 μm² in oneexample. It results in significant STI dishing effect due to large STIdimensions and causes the Hi-R polysilicon resistors on the STIstructure lower than the polysilicon structures in other regions. As aconsequence, the metal residue on the interlayer dielectric (ILD) andbetween the Hi-R resistors is difficult to remove during the metalpolishing. The metal residue will lead to shorting and the failure ofthe Hi-R resistors. Therefore, a polysilicon resistor structure and amethod making the same are needed to address the above issues.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a flowchart of a method making a semiconductor structurehaving a resistor constructed according to various aspects in oneembodiment.

FIGS. 2-7 are sectional views of one embodiment of the semiconductorstructure of FIG. 1 at various fabrication stages constructed accordingto various aspects in one or more embodiments.

FIG. 8 is a flowchart of a method making a semiconductor structurehaving a resistor constructed according to various aspects in anotherembodiment.

FIGS. 9-12 are sectional views of one embodiment of the semiconductorstructure of FIG. 8 at various fabrication stages constructed accordingto various aspects in one or more other embodiments.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof various embodiments. Specific examples of components and arrangementsare described below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a first feature over or on a second featurein the description that follows may include embodiments in which thefirst and second features are formed in direct contact, and may alsoinclude embodiments in which additional features may be formedinterposing the first and second features, such that the first andsecond features may not be in direct contact.

FIG. 1 is a flowchart of a method 100 for making a semiconductorstructure according to one embodiment. FIGS. 2 through 7 are sectionalviews of a semiconductor structure 200 having a resistor at variousfabrication stages and constructed according to one or more embodiments.The semiconductor structure 200 and the method 100 of making the sameare collectively described with reference to FIGS. 1 through 7.

Referring to FIGS. 1 and 2, the method 100 begins at step 102 byproviding a semiconductor substrate 210. The semiconductor substrate 210includes silicon. Alternatively, the semiconductor substrate 210includes germanium, silicon germanium or other proper semiconductormaterials.

Still referring to FIGS. 1 and 2, the method 100 proceeds to step 104 byforming various isolation features such as shallow trench isolation(STI) features 212 in the substrate. The STI features 212 includes oneor more first STI features 212 a of a first width “W1” and one or moresecond STI features 212 b of a second width “W2” substantially less thanthe first width “W1” as illustrated in FIG. 2. The various STI features(212 a and 212 b) formed in the semiconductor substrate 210 definevarious active regions 216 in the semiconductor substrate 210.

The STI features 212 are formed in the substrate 210 by a procedureincluding etching, deposition and polishing. The formation of the STIfeatures 212 is described below accordingly to one embodiment, which isnot intended to limit the scope of the present disclosure. A hard masklayer (not shown) is formed on the semiconductor substrate 210. The hardmask layer includes a silicon oxide layer on the semiconductor substrate210 and a silicon nitride layer on the silicon oxide layer in oneexample. In another example, the hard mask layer is formed by growing apad oxide layer and forming a low pressure chemical vapor deposition(LPCVD) silicon nitride layer.

The hard mask layer is patterned to have various openings to defineregions on the semiconductor substrate 210 for the STI features 212. Inthe present embodiment, the openings include one or more first openingswith the first width “W1” and one or more second openings with thesecond width “W2” in the hard mask layer.

The patterning of the hard mask layer includes forming a patternedphotoresist layer on the hard mask layer, etching the hard mask layerusing the patterned photoresist layer as an etch mask, and photoresiststripping. The formation of the patterned photoresist layer may furtherinclude processing steps of photoresist coating, soft baking, maskaligning, pattern exposing, post-exposure baking, photoresistdeveloping, and hard baking. The photolithography patterning may also beimplemented or replaced by other suitable methods such as masklessphotolithography, electron-beam writing, ion-beam writing, and molecularimprint.

The semiconductor substrate 210 is then etched through the openings ofthe hard mask layer to form trenches in the semiconductor substrate 210.In the present embodiment, the trenches include one or more firsttrenches transferred from the first openings having the first width “W1”and one or more second trenches transferred from the second openingshaving the second width “W2”.

The various trenches in the semiconductor substrate 210 are filled byone or more dielectric materials such as silicon oxide, silicon nitride,silicon oxynitride, low k dielectric material, other suitable dielectricmaterial or combinations thereof. The filled trench may have amulti-layer structure. In one example, the materials filling thetrenches include a thermal oxide liner layer and another dielectricmaterial, such as silicon oxide by chemical vapor deposition (CVD).

A chemical mechanical polishing (CMP) process is applied to thesemiconductor substrate 210 to remove the excessive filled material(s)and to globally planarize the surface of the semiconductor substrate210, resulting in the first STI features 212 a and the second STIfeatures 212 b. The first STI features 212 a have the first width “W1”substantially greater than the second width “W2” of the second STIfeatures 212 b. As a result, the dishing effect 218 is present to thefirst STI features 212 a, which causes the top surface of the first STIfeatures 212 a to be lower than the top surface 220 of the second STIfeatures 212 b.

The hard mask layer is then removed by one or more suitable etchingsteps, such as hot phosphoric acid, hydrofluoric (HF) acid, or both.Alternatively, the pad oxide layer may stay at the present stage and isused as an implant screen layer to avoid a tunneling effect duringsubsequent implantation steps.

Referring to FIGS. 1 and 3, the method 100 proceeds to step 106 byforming one or more n-wells in a first subset of the active regions 216.A patterned photoresist layer 224 is formed on the semiconductorsubstrate 210. The patterned photoresist layer 224 covers the first STIfeatures 212 a and a second subset of the active regions 216. Thepatterned photoresist layer 224 includes openings aligned with the firstsubset of the active regions 216 and the second STI features 212 b,exposing those regions and features. The patterned photoresist layer 224is formed by a process similar to the formation of the patternedphotoresist layer for patterning the hard mask layer and defining trenchregions for various STI features. For example, the patterned photoresistlayer 224 is formed by a procedure including photoresist coating, softbaking, mask aligning, exposing, post-exposure baking, developing, andhard baking.

An n-type ion implantation 226 is applied to the semiconductor substrate210 using the patterned photoresist layer 224 as an implant mask,introducing an n-type impurity into the first subset of the activeregions 216 and forming the n-wells 228 therein. The n-type impurityincludes phosphoric (P) or arsenic (As) in one example. The n-type ionimplantation 226 introduces the n-type impurity into the second STIfeatures 212 b as well, changing the characteristic of the second STIfeatures 212 b and making the second STI features 212 b more vulnerableand less resistive to the subsequent etching processes relative to thefirst STI features 212 a. The patterned photoresist layer 224 is removedthereafter by plasma ashing or wet stripping.

Referring to FIGS. 1 and 4, the method 100 proceeds to step 108 byforming one or more p-wells in the second subset of the active regions216. A patterned photoresist layer 232 is formed on the semiconductorsubstrate 210. The patterned photoresist layer 232 covers the firstsubset of the active regions 216 and the first STI features 212 a. Thepatterned photoresist layer 232 includes openings aligned with thesecond subset of the active regions 216 and the second STI features 212b, exposing those regions/features. The patterned photoresist layer 232is formed by a process similar to the process to form the patternedphotoresist layer 224.

A p-type ion implantation 234 is applied to the semiconductor substrate210 using the patterned photoresist layer 232 as an implant mask,introducing a p-type impurity into the second subset of the activeregions 216 and forming the p-wells 236 therein. The p-type impurityincludes boron (B) or indium (In) in one example. The p-typed ionimplantation 234 introduces the p-type impurity into the second STIfeatures 212 b as well, changing the characteristic of the second STIfeatures 212 b, and making the second STI features 212 b more vulnerableand less resistive to the subsequent etching processes relative to thefirst STI features 212 a. The patterned photoresist layer 232 is removedthereafter by plasma ashing or wet stripping.

Referring to FIGS. 1 and 5, the method 100 proceeds to step 110 byimplementing various etching processes to the semiconductor substrate210 thereafter. Due to the different characteristics between the firstSTI features 212 a and the second STI features 212 b, the second STIfeatures 212 b have a higher etch rate than the first STI features 212a. Stated differently, an etching process removes the second STIfeatures 212 b at a greater rate than the first STI features 212 a.Thus, the thickness difference between the first and second STI features212 a and 212 b is reduced. The various etching processes are describedbelow according to one or more embodiments.

In one embodiment, various ion implantation processes are implemented,including ion implantations to tune channel doping profile, such as anion implantation to tune threshold voltage and/or an ion implantation toreduce the punch-through effect. Those implantation processes areapplied to the n-wells 228 and the p-wells 236, respectively. Duringthose ion implantation processes, an implantation screen layer may beformed on the semiconductor substrate 210 to avoid the implantationtunneling effect. After the completion of one or more implantationprocesses, the implantation screen layer is removed by an etchingprocess. In the present embodiment, the implantation screen layerincludes silicon oxide. The corresponding etching process can reduce thethicknesses of the STI features. Specifically, the corresponding etchingprocess removes more of the second STI features 212 b than the first STIfeatures 212 a. In one example, the corresponding etching process usesan HF etching solution.

In another embodiment, a chemical cleaning process is applied tosemiconductor substrate 210 after one or more ion implantation steps.The chemical cleaning process can also reduce the thicknesses of the STIfeatures 212. Similarly, as the first and second STI features 212 a and212 b have different resistance to etching and chemical cleaning due todifferent characteristics, the chemical cleaning process removes morethe second STI features 212 b than the first STI features 212 a.

In yet another embodiment, a hard mask may be used as an implant maskduring one or more implant processes. The hard mask is removedthereafter by an etching process. The first and second STI 212 areexposed for the etching as well. Similarly, since the first and secondSTI features 212 a and 212 b have different resistance to etching, thecorresponding etching process removes the second STI features 212 b moreso than the first STI features 212 a.

In yet another embodiment, the semiconductor substrate 210 includesfield effect transistors (FETs) in a first region for input and output(I/O) circuit and FETs in a second region for core circuit. Since theI/O circuit is designed to have high resistance to electrostaticdischarge (ESD) events, different gate dielectric layers are used forthe I/O FETs and the core FETs, respectively. Particularly, the I/O FETsinclude a first gate dielectric layer having a first thickness, and thecore FETs include a second gate dielectric layer having a secondthickness. The first thickness is substantially greater than the secondthickness. In furtherance of the embodiment, the first and second gatedielectric layers are formed separately. In the depicted embodiment, thefirst gate dielectric layer is formed on the semiconductor substrate210, and is then patterned to remove a portion in the second region forthe core circuit. In one example, the first gate dielectric layerincludes silicon oxide. The first gate dielectric layer is selectivelyremoved from the second region by an etching process, such as HFetching. The first and second STI features 212 are exposed to theetching process as well. Similarly, as the first and second STI features212 a and 212 b have different resistance to etching due to differentcharacteristics, the etching process removes more of the second STIfeatures 212 b than the first STI features 212 a.

By implementing one or more etching processes described above in variousembodiments, the thicknesses of the first and second STI features 212are compensated, as illustrated in FIG. 5. The difference between thetop surface of the first STI features 212 a and the top surface of thesecond STI features 212 b is substantially reduced.

The method 100 compensates the height difference between the first andsecond STI features 212 a and 212 b without complicating themanufacturing process. For example, no additional processing step isadded to the process flow. Only one or more photomasks are modified withthe corresponding design patterns. This can be easily achieved prior tomaking the photomask. For example, a logic operation is applied to acircuit design pattern to the n-well implant photomask such that then-well implant photomask defines openings for both the n-well and thesecond STI features while the p-wells and the first STI features aredefined as blackout regions in the photomask. In another example, alogic operation is applied to a circuit design pattern to the p-wellimplant photomask such that the p-well implant photomask definesopenings for both the p-well and the second STI features while then-wells and the first STI features are defined as blackout regions inthe photomask.

Referring to FIGS. 1 and 6, the method 100 proceeds to step 112 byforming resistors 237 on the first STI features 212 a. In oneembodiment, the resistors 237 include doped polycrystalline silicon(polysilicon) configured on the first STI features 212 a. In anotherexample, the resistors 237 are designed to have high resistances (Hi-R)achieved by the proper dimensions and doping concentration of theresistors 237.

In the present embodiment, the gate stacks for various FETs and theresistors 237 are formed simultaneously in the same procedure. Adielectric layer 238 is formed on the semiconductor substrate 210 by asuitable process, such as thermal oxide or atomic layer deposition (ALD)or CVD. In this example, the STI features 212 and the gate dielectriclayer 238 both include silicon oxide. The gate dielectric layer 238 onthe STI features 212 is not separately labeled. A polysilicon layer 240is formed on the gate dielectric layer 238 and is further patterned bylithography and etching to form various polysilicon stacks, such aspolysilicon stacks 240 a, 240 b and 240 c. Specifically, the polysiliconstacks include one or more first polysilicon stacks 240 a disposed onthe first STI features 212 a, resulting one or more resistors 237. Thepolysilicon stacks include one or more second polysilicon stacks 240 bdisposed on the active regions 216, forming one or more gate electrodesfor the FETs. In the depicted embodiment, the polysilicon stacks alsoinclude one or more third polysilicon stacks 240 c disposed on thesecond STI features 212 b, forming one or more dummy gate electrodes forimproving pattern density or for other process integrationconsideration.

By implementing one or more above described etching processes to thesemiconductor structure 200 according to various embodiments, the heightdifference between the first and second STI features 212 a and 212 b issubstantially reduced. Accordingly, the gate stacks 240 b (and the dummygate stacks 240 c as well) and the resistors 240 a have a substantiallyplanarized and flush top surface 242 as illustrated in FIG. 6.

Referring to FIGS. 1 and 7, the method 100 may proceed to step 114 byforming other circuit features such as source and drain features in theactive regions of the semiconductor substrate, and/or multilayerinterconnection (MLI) on the semiconductor substrate 210.

In one embodiment, the source and drain regions (not shown) includelight doped drain (LDD) regions and heavily doped source and drain (S/D)features, collectively referred to as source and drain, formed by one ormore implantation processes. For example, n-type FETs (nFETs) are formedon the p-wells 236, and p-type FETs (pFETs) are formed on the n-wells228. The source and drain are formed, respectively, for the n-type FETsand the p-type FETs, using proper doping species. In one embodiment,taking n-type FETs as an example, the LDD features are formed by an ionimplantation with a light doping dose. Thereafter, spacers are formed bydielectric deposition and anisotropic etch, such as plasma etch. Thenthe heavily doped S/D features are formed by an ion implantation with aheavy doping dose. The various source and drain features of the p-typeFETs can be formed in a similar procedure but with opposite doping type.The sidewall spacer can be formed to the resistors in the process toform the spacers of nFETs and the pFETs. In one embodiment, a hightemperature annealing process is subsequently performed to activate thevarious doping species in the source and drain regions.

In another embodiment, the resistors 237 are doped by one or moreimplantation steps to tune or increase the resistivity thereof. In oneexample, the resistors 237 are doped by one or more separateimplantation steps for independently tuning the resistivity thereof. Inanother example, a subset of the implantation steps to form n-type S/Dor p-type S/D are applied to the resistors 237 as well.

In another embodiment, an inter-level dielectric (ILD) layer 244 (alsoreferred to as ILDO) is formed on the semiconductor substrate 210.Particularly, the ILD layer 244 substantially fills the gaps between thepolysilicon stacks 240. The ILD layer 244 includes silicon oxide, low kdielectric material, other suitable dielectric materials, orcombinations thereof. The ILD layer 244 is formed by a suitabletechnique, such as CVD. For example, a high density plasma CVD can beexecuted to form the ILD layer 244. In furtherance of the embodiment,the ILD layer 244 is formed on the semiconductor substrate 210 to alevel above the top surface of the resistors and the gate stacks.

A CMP process is applied to the ILD layer 244 to reduce the thickness ofthe ILD layer 244 such that the resistors 237 and the gate stacks areexposed from the top side. The processing conditions and parameters ofthe CMP process, including slurry chemical and polishing pressure, canbe tuned to partially remove and planarize the ILD layer 244.

In the present embodiment, the resistors 237 have high resistance(referred to as high resistance or Hi-R resistor). In furtherance of thepresent embodiment, the Hi-R resistors 237 are formed on a STI featurewith large dimensions, for example, dimensions greater than 10 micron×10micron. The first STI features 212 a with the first width “W1” isincorporated in the semiconductor structure 200. As mentioned above, thefirst STI features 212 a have a significant dishing effect than thesecond STI features 212 b, resulting in the height differencetherebetween. Again, since the height difference between the first andsecond STI features 212 a and 212 b is substantially reduced by theabove described steps, the gate stacks 240 b (as well as the dummy gatestacks 240 c), the resistors 240 a and the ILD layer 244 have asubstantially planarized top surface as illustrated in FIG. 7. Whencontacts are formed in the ILD layer 244, or when metal gates are formedto replace the polysilicon gate electrodes, undesired metal residue onthe ILD layer 244 between the resistors 237 on the first STI features212 are eliminated, and the corresponding short issue is eliminated aswell.

FIG. 8 is a flowchart of a method 300 for making a semiconductorstructure according to another embodiment. FIGS. 9 through 12 aresectional views of a semiconductor structure 400 having one resistor atvarious fabrication stages and constructed according to one or moreother embodiments. The semiconductor structure 400 and the method 300 ofmaking the same are collectively described with reference to FIGS. 8through 12.

Referring to FIGS. 8 and 9, the method 300 begins at step 302 byproviding a semiconductor substrate 210. The semiconductor substrate 210includes silicon. Alternatively, the substrate includes germanium,silicon germanium or other proper semiconductor materials.

Still referring to FIGS. 8 and 9, the method 300 proceeds to step 304 byforming various isolation features such as shallow trench isolation(STI) features 212 in the substrate. The STI features 212 include one ormore first STI features 212 a of a first width “W1” and one or moresecond STI feature 212 b of a second width “W2” substantially less thanthe first width “W1” as illustrated in FIG. 9. The various STI features(212 a and 212 b) formed in the semiconductor substrate 210 definevarious active regions 404 and 406 in the semiconductor substrate 210.In the depicted embodiment, the semiconductor substrate 210 includesfirst active regions 404 for the I/O circuit and second active regions406 for the core circuit.

The formation of the STI features 212 is similar to the formation of theSTI features 212 in FIG. 2. For example, the STI features 212 are formedby a procedure including, forming a patterned hard mask, etching thesemiconductor substrate 210 to form trenches, filling the trenches withone or more dielectric materials, and applying a CMP process to removethe excessive dielectric materials and to planarize the surface of thesemiconductor substrate.

The method 300 may also include other processing steps, such as variousion implantation steps. In one embodiment, the other processing stepsinclude ion implantations to form respective n-wells and p-wells. In oneexample, the implantation processes to form the n-wells and the p-wellsare similar to the steps 106 and 108 of FIG. 1. In a particular example,the ion implantation to form the n-wells are applied to thesemiconductor substrate 210 through an implantation mask with openingsaligned with the active regions for the n-wells and the second STIfeatures 212 b while the active regions for the p-wells and the firstSTI features 212 a are covered from the corresponding ion implantation.Similarly, the ion implantation to form the p-wells are applied to thesemiconductor substrate 210 through another implantation mask withopenings aligned with the active regions for the p-wells and the secondSTI features 212 b while the active regions for the n-wells and thefirst STI features 212 a are covered from the corresponding ionimplantation according to another example.

In another embodiment, the other processing steps include various ionimplantation processes to tune the channel doping profiles for p-typeFETs and n-type FETs, such as an ion implantation to tune thresholdvoltage and/or an ion implantation to reduce the punch-through effect.Those implantation processes are applied to the n-wells and the p-wells,respectively. In yet another embodiment, during those ion implantationprocesses, an implantation screen layer may be formed on thesemiconductor substrate 210 to avoid the implantation tunneling effect.After the completion of one or more implantation processes, theimplantation screen layer is removed by an etching process.

Still referring to FIGS. 8 and 9, the method 300 proceeds to step 306 byforming an I/O gate oxide layer 402 on the semiconductor substrate 210.The semiconductor substrate 210 includes the first active region 404 forI/O circuit and the second active region 406 for core circuit. Since theI/O circuit is designed to have high resistance to electrostaticdischarge (ESD) events, the corresponding gate dielectric layer 402 forthe I/O FETs has a thickness greater than that of the core FETs. The I/Oand core gate dielectric layers are formed separately. In the depictedembodiment, the I/O gate dielectric layer 402 is formed on thesemiconductor substrate 210. In one example, the I/O gate dielectriclayer 402 includes silicon oxide, and the STI features 212 includesilicon oxide. The I/O gate dielectric layer 402 of silicon oxide mayhave a thickness ranging between about 30 and about 60 angstrom. The I/Ogate dielectric layer 402 may be formed by thermal oxide, atomic layerdeposition (ALD) or other suitable technique. A portion of the I/O gatedielectric layer 402 on the STI features 212 is not separately labeledin FIG. 8 and is collectively labeled as the STI features 212 a or 212b. This illustration is only for simplicity and is not intended to limitthe scope of the present disclosure. The I/O gate dielectric layer 402may additionally or alternatively include other suitable dielectricmaterial, such as high k dielectric material formed by a suitabletechnique.

Referring to FIGS. 8 and 10, the method 300 proceeds to step 308 byselectively removing the I/O gate dielectric layer 402 from the secondactive region 406 of the semiconductor substrate 210. In the presentembodiment, the selective removal of the I/O gate dielectric layer 402includes a lithography process and an etching process.

A patterned photoresist layer 408 is formed on the I/O gate dielectriclayer 402. The patterned photoresist layer 402 includes various openingsthat expose the second active region 406 and the second STI features 212b while the first active region 404 and the first STI features 212 a arecovered by the patterned photoresist layer 408. The patternedphotoresist layer 408 is formed by a process similar to the process offorming the patterned photoresist layer 232 in FIG. 4.

An etching process is applied to the I/O gate dielectric layer 402through the openings of the patterned photoresist layer 408. The etchingprocess employs a suitable etching technique with proper etchant. In thepresent embodiment, the I/O gate dielectric layer 402 includes siliconoxide, and the etching process includes a wet etching process using a HFetchant.

During the etching process applied to the I/O gate dielectric layer 402,the second STI features 212 b are exposed to the etching process aswell, and the thickness of the second STI features 212 b is reducedthereby, while the first STI features 212 a are covered from the etchingprocess. The height difference between the first STI features 212 a andthe second STI features 212 b is substantially reduced.

Referring to FIG. 11, a core gate dielectric layer 410 for the core FETsis further formed on the semiconductor substrate 210. In one embodiment,the core gate dielectric layer 410 is patterned such that it isselectively removed from the active regions 404. In furtherance of theembodiment, another etching process is applied to the core gatedielectric layer to selectively remove the core gate dielectric layerfrom the active regions 404 and the second STI features 212 b while theactive regions 406 and the first STI features 212 a are covered by anetch mask (such as another patterned photoresist layer) from the etchingprocess. The height difference between the first STI features 212 a andthe second STI features 212 b is further reduced or eliminated.

In another embodiment, the core gate dielectric layer is formed on thesecond active regions 406 for the core circuit and the first activeregions 404 for the I/O circuit. Thus the collective thickness of thegate dielectric layer for the FETs in the first active regions 404 forthe I/O circuit is the total of the I/O and core gate dielectric layers.

Still referring to FIGS. 8 and 11, the method 300 proceeds to step 310by forming one or more resistors 237 on the first STI features 212 a. Inone embodiment, the resistors 237 include doped polycrystalline silicon(polysilicon). In another example, the resistors 237 are designed tohave high resistances achieved by the proper dimensions and dopingconcentration.

In the present embodiment, the resistors 237 and various gate stacks areformed simultaneously in a same procedure. A polysilicon layer 240 isformed on the semiconductor substrate 210 and is further patterned bylithography and etching to form various polysilicon stacks, such aspolysilicon stacks 240 a, 240 b and 240 c. Specifically, the polysiliconstacks include one or more first polysilicon stacks 240 a disposed onthe first STI features 212 a, resulting in one or more resistors 237.The polysilicon stacks include one or more second polysilicon stacks 240b disposed on the gate dielectric layer 402 on the first active regions404, forming one or more gate electrodes for the I/O FETs. Thepolysilicon stacks further include one or more second polysilicon stacks240 b disposed on the gate dielectric layer 410 on the second activeregions 406, forming one or more gate electrodes for the core FETs. Inthe depicted embodiment, the polysilicon stacks also include one or morethird polysilicon stacks 240 c disposed on the second STI features 212b, forming dummy gate electrodes for improving pattern density or otherprocess integration consideration.

By implementing steps 306 and 308 of the method 300 according to variousembodiments, the height difference between the first and second STIfeatures 212 a and 212 b is substantially reduced. Accordingly, the gatestacks 240 b (the dummy gate stacks 240 c as well) and the resistors 240a have a substantially planarized top surface 242 as illustrated in FIG.11.

Referring to FIGS. 8 and 12, the method 300 may proceed to the step 312by forming other features such as source and drain features in theactive regions, and/or multilayer interconnection (MLI) on thesemiconductor substrate 210. The step 312 is similar to the step 114 ofthe method 100.

In one embodiment, the source and drain regions (not shown), includingLDD regions and heavily doped source and drain (S/D) features(collectively referred to as source and drain), are formed by one ormore implantation processes. The source and drain are formed,respectively, for the n-type FETs and the p-type FETs, using properdoping species.

In another embodiment, the resistors 237 are doped by one or moreimplantation steps to tune or increase the resistivity thereof. In oneexample, the resistors 237 are doped by one or more separateimplantation steps for independently tuning the resistivity thereof. Inanother example, a subset of the implantation steps to form n-type S/Dor p-type S/D are applied to the resistors 237 as well.

In yet another embodiment, an ILD layer 244 is formed on thesemiconductor substrate 210. Particularly, the ILD layer 244substantially fills the gaps between the polysilicon stacks 240. The ILDlayer 244 includes silicon oxide, low k dielectric material, othersuitable dielectric materials, or combinations thereof. The ILD layer244 is formed by a suitable technique, such as CVD. For example, a highdensity plasma CVD can be executed to form the ILD layer 244. Infurtherance of the embodiment, the ILD layer 244 is formed on thesemiconductor substrate 210 to a level above the top surface of theresistors and the gate stacks.

A CMP process is applied to the ILD layer 244 to reduce the thickness ofthe ILD layer 244 such that the resistors 237 and the gate stacks areexposed from the top side. The processing conditions and parameters ofthe CMP process, including slurry chemical and polishing pressure, canbe tuned to partially remove and planarize the ILD layer 244.

The MLI is formed on the semiconductor substrate 210, which includesvertical interconnects, such as conventional vias or contacts, andhorizontal interconnects, such as metal lines. The variousinterconnection features may use various conductive materials includingcopper, tungsten and silicide. In one example, a damascene process isused to form copper related multilayer interconnection structure. Inanother embodiment, tungsten is used to form tungsten plug in thecontact holes.

Since the height difference between the first and second STI features212 a and 212 b is substantially reduced by the above described steps,the gate stacks 240 b (the dummy gate stacks 240 c as well), theresistors 240 a and the ILD layer 244 have a substantially planarizedtop surface 242 as illustrated in FIG. 12. When contacts are formed inthe ILD layer 244, or metal gates are formed to replace the polysilicongate electrodes, undesired metal residue on the ILD layer 244 betweenthe resistors 237 are eliminated and the corresponding short issue isavoided.

Although not shown, alternatives materials and processing steps may beused to form various features. In one embodiment, the method 100 and themethod 300 may be combined by taking the advantages of STI heightdifference reduction from both methods. For example, the method mayinclude a selective etching process (step 308 in the method 300) and aprocedure of differentiating the STI etching resistance and performingan etching process thereafter (steps 106/108 and 110 in the method 100)to reduce the STI height difference. In another embodiment, one or moreresistors 237 formed on the first STI features 212 a can be properlyconfigured and alternatively used as a polysilicon fuse (or amorphoussilicon fuse) for other applications. In another embodiment, theresistors are configured as an array, each being disposed on the firstSTI features 212 and adjacent passive devices being separated by activeregions. The semiconductor structure 200/400 is a portion of anintegrated circuit having both plurality of resistors and various fieldeffect transistors each with a gate stack of high k dielectric and metalelectrode. In this case, the polysilicon gate stacks 240 b are replacedby gate stacks of high k dielectric and metal electrode. In anotherembodiment, the polysilicon layer 240 can be in-situ doped (such asboron doped).

In another embodiment, during each ion implantation, a hard mask may beused as an implantation mask. In a detailed description of theembodiment, a hard mask layer is deposited on the semiconductorsubstrate 210. The hard mask layer includes a dielectric material, suchas silicon oxide, silicon nitride, silicon oxynitride or combinationsthereof. The hard mask layer is formed CVD or other suitable technique.A patterned photoresist layer is formed on the hard mask layer and isused to pattern the hard mask layer using an etching process such thatthe openings of the patterned photoresist layer are transferred to thehard mask layer. The patterned photoresist layer is removed by wetstripping or plasma ashing. The respective ion implantation is appliedto the semiconductor substrate 210 through the openings of the hard masklayer. The hard mask layer is removed thereafter.

In another embodiment, a p-type FET (pFET) has a strained structure forenhanced carrier mobility and improved device performance. Infurtherance of the embodiment, silicon germanium (SiGe) is formed in thesource and drain regions of the pFET to achieve a proper stress effect.In one example of forming such a strained pFET, the silicon substratewithin the source and drain regions of the pFET are recessed by one ormore etching step. Then SiGe is epi grown in the recessed regions andheavy doped source and drain are formed in the epi grown SiGe features.In another example, a dummy spacer is formed after the formation of theLDD features. The dummy spacer is removed after the formation of theSiGe features. Then a main spacer is formed on the sidewalls of theassociated gate stack, with a different thickness such that the heavydoped source and drain have an offset from the SiGe features. Forinstance, the main spacer is thicker than the dummy spacer such that theheavy doped source and drain are formed in the SiGe features.

In another embodiment, an n-type FET (nFET) has a strained structure forenhanced carrier mobility and improved device performance. Infurtherance of the embodiment, silicon carbide (SiC) is formed in thesource and drain regions of the nFET to achieve a proper stress effectat step 104. The strained nFET can be formed similarly the strainedpFET. In another embodiment, the n-metal and p-metal layers each mayinclude other proper metal or metal alloy. In another embodiment, then-metal and p-metal layers each have a multi-layer structure to have anoptimized work function and reduced threshold voltage. Other processingsteps may be implemented before, during and/or after the formation ofthe resistors.

In another embodiment, the method 100 or 300 may be executed in adifferent sequence. For example, the step 106 for n-well implantationand the step 108 for p-well implantation are implemented in a differentorder such that the step 108 for p-well implantation is implementedfirst and the step 106 for n-well implantation is implementedthereafter.

The present disclosure is not limited to applications in which thesemiconductor structure includes a FET (e.g. MOS transistor) and apolysilicon resistor (or polysilicon fuse), and may be extended to otherintegrated circuit having a metal gate stack. For example, thesemiconductor structures may include a dynamic random access memory(DRAM) cell, an imaging sensor, a capacitor and/or other microelectronicdevices (collectively referred to herein as microelectronic devices). Inanother embodiment, the semiconductor structure includes FinFETtransistors. Of course, aspects of the present disclosure are alsoapplicable and/or readily adaptable to other types of transistors,including single-gate transistors, double-gate transistors and othermultiple-gate transistors, and may be employed in many differentapplications, including sensor cells, memory cells, logic cells, andothers.

Thus, the present disclosure provides one embodiment of a method makingan integrated circuit. The method includes forming a first isolationfeature of a first width and a second isolation feature of a secondwidth in a substrate, the first width being substantially greater thanthe second width; forming an implantation mask on the substrate, whereinthe implantation mask covers the first isolation feature and uncoversthe second isolation feature; performing an ion implantation process tothe substrate using the implantation mask; and thereafter performing anetching process to the substrate.

In one embodiment of the disclosed method, the forming of the first andsecond isolation features includes etching the substrate to form a firsttrench and a second trench in the substrate; filling a dielectricmaterial in the first and second trench; and thereafter applying apolishing process to the substrate, resulting in the first and secondisolation features. The forming the implantation mask on the substratemay include forming a photoresist layer on the substrate. In oneembodiment, the implantation mask includes a first opening to expose thesecond isolation feature and an N-well active region in the substrate;and the ion implantation process uses a p-type dopant. In anotherembodiment, the implantation mask includes a first opening to expose thesecond isolation feature and a P-well active region in the substrate;and the ion implantation process uses an n-type dopant. In variousembodiments, the performing the etching process includes one selectedfrom the group consisting of etching to pattern a second gate dielectricmaterial layer for I/O circuit; etching to remove an implantation screenlayer; implantation cleaning; and combinations thereof. The performingthe etching process includes performing the etching process using anetch mask covering the second isolation feature and uncovering the firstisolation feature. In another embodiment, the method further includesforming a dielectric material layer on the substrate; forming an etchmask on the dielectric material layer, wherein the etch mask covers thefirst isolation feature and an active region for I/O circuit; anduncovers the second isolation feature and an active region for corecircuit; and performing an etching process to the dielectric materiallayer through the etch mask. In other embodiments, the dielectricmaterial layer includes silicon oxide; and the etch mask includes aphotoresist layer. The method may further include forming a resistanceresistor on the first isolation feature after the performing the etchingprocess to substrate. The forming the resistance resistor on the firstisolation feature may include forming a doped polysilicon resistor withhigh resistance. In another embodiment, the forming the resistorincludes forming a polysilicon layer on the substrate; and patterningthe polysilicon layer to form a polysilicon resistor on the firstisolation feature and a polysilicon gate on an active region. In yetanother embodiment, the performing the ion implantation process to thesubstrate includes introducing a dopant to the second isolation feature,reducing a resistance of the second isolation feature to the etchingprocess; and the performing the etching process includes etching thefirst isolation feature with a first etch rate and etching the secondisolation feature with a second etch rate greater than the first etchrate.

The present disclosure also provides another embodiment of a methodmaking an integrated circuit. The method includes forming a firstisolation feature of a first width and a second isolation feature of asecond width in a semiconductor substrate, the first width beingsubstantially greater than the second width; forming a dielectricmaterial layer on the semiconductor substrate; forming an etch mask onthe dielectric material layer. The etch mask is patterned to cover thefirst isolation feature and a first active region, and to uncover thesecond isolation feature and a second active region; and performing anetching process to the dielectric material layer through the etch mask,reducing a thickness of the second isolation feature. In anotherembodiment, the first active region is configured for an input/output(I/O) device; and the second active region is configured for a coredevice. In yet another embodiment, the first and second isolationfeatures include silicon oxide; and the dielectric material layerincludes silicon oxide. In yet another embodiment, the method furtherincludes forming an implantation mask on the substrate, wherein theimplantation mask covers the first isolation feature and uncovers thesecond isolation feature; and performing an ion implantation process tothe substrate using the implantation mask. In yet another embodiment,the method further includes forming a polysilicon layer on thesubstrate; and patterning the polysilicon layer to form a polysiliconresistor on the first isolation feature and a polysilicon gate on anactive region.

The present disclosure also provides an embodiment of an integratedcircuit. The integrated circuit includes a semiconductor substrate; afirst shallow trench (STI) isolation feature of a first width and asecond STI feature of a second width in a semiconductor substrate, thefirst width being substantially less than the second width; afield-effect transistor (FET) disposed in an active region of thesemiconductor substrate; and a resistor disposed on the second STIfeature, wherein the first STI includes an impurity of a first dopingconcentration substantially higher than a second doping concentration ofthe impurity in the second STI feature. In one example, the integratedcircuit further includes a gate stack disposed on an active region,wherein the gate stack and the resistor include polysilicon. In anotherexample, the integrated circuit further includes a first field effecttransistor (FET) for an input/output (I/O) circuit, the first FETincludes a first gate oxide layer of a first thickness; a second FET fora core circuit, the second FET includes a second gate oxide layer of asecond thickness substantially less than the first thickness, whereinthe first and second STI features include silicon oxide.

The foregoing has outlined features of several embodiments. Thoseskilled in the art should appreciate that they may readily use thepresent disclosure as a basis for designing or modifying other processesand structures for carrying out the same purposes and/or achieving thesame advantages of the embodiments introduced herein. Those skilled inthe art should also realize that such equivalent constructions do notdepart from the spirit and scope of the present disclosure, and thatthey may make various changes, substitutions and alterations hereinwithout departing from the spirit and scope of the present disclosure.

1. A method of making an integrated circuit, the method comprising:forming a first isolation feature of a first width and a secondisolation feature of a second width in a substrate, the first widthbeing substantially greater than the second width; forming animplantation mask on the substrate, wherein the implantation mask coversthe first isolation feature and exposes the second isolation feature;performing an ion implantation process to the substrate using theimplantation mask; and thereafter performing an etching process to thesubstrate.
 2. The method of claim 1, wherein the forming of the firstand second isolation features includes: etching the substrate to form afirst trench and a second trench in the substrate; filling the first andsecond trenches with a dielectric material; and thereafter applying apolishing process to the substrate, thereby forming the first and secondisolation features.
 3. The method of claim 1, wherein the forming theimplantation mask on the substrate includes forming a photoresist layeron the substrate.
 4. The method of claim 1, wherein: the implantationmask includes a first opening that exposes the second isolation featureand an N-well active region in the substrate; and the ion implantationprocess uses a p-type dopant.
 5. The method of claim 1, wherein: theimplantation mask includes a first opening that exposes the secondisolation feature and a P-well active region in the substrate; and theion implantation process uses an n-type dopant.
 6. The method of claim1, wherein the performing the etching process includes a processselected from the group consisting of: etching to pattern a second gatedielectric material layer for I/O circuit; etching to remove animplantation screen layer; implantation cleaning; and combinationsthereof.
 7. The method of claim 1, wherein the performing the etchingprocess includes performing the etching process using an etch maskcovering the second isolation feature and exposing the first isolationfeature.
 8. The method of claim 1, further comprising: forming adielectric material layer on the substrate; forming an etch mask on thedielectric material layer, wherein the etch mask covers the firstisolation feature and an active region for I/O circuit; and exposes thesecond isolation feature and an active region for core circuit; andperforming an etching process to the dielectric material layer throughthe etch mask.
 9. The method of claim 8, wherein: the dielectricmaterial layer includes silicon oxide; and the etch mask includes aphotoresist layer.
 10. The method of claim 1, further comprising forminga resistor on the first isolation feature after the performing theetching process to the substrate.
 11. The method of claim 10, whereinthe forming the resistance resistor on the first isolation featureincludes forming a doped polysilicon resistor with high resistance. 12.The method of claim 10, wherein the forming the resistor includes:forming a polysilicon layer on the substrate; and patterning thepolysilicon layer to form a polysilicon resistor on the first isolationfeature and a polysilicon gate on an active region.
 13. The method ofclaim 1, wherein: the performing the ion implantation process to thesubstrate includes introducing a dopant to the second isolation feature,reducing a resistance of the second isolation feature to the etchingprocess; and the performing the etching process includes etching thefirst isolation feature with a first etch rate and etching the secondisolation feature with a second etch rate greater than the first etchrate.
 14. A method of making an integrated circuit, the methodcomprising: forming a first isolation feature having a first width and asecond isolation feature having a second width in a semiconductorsubstrate, the first width being substantially greater than the secondwidth; forming a dielectric material layer on the semiconductorsubstrate; forming an etch mask on the dielectric material layer,wherein the etch mask is patterned to cover the first isolation featureand a first active region, and to uncover the second isolation featureand a second active region; and performing an etching process to thedielectric material layer through the etch mask, reducing a thickness ofthe second isolation feature.
 15. The method of claim 14, wherein: thefirst active region is configured for an input/output (I/O) device; andthe second active region is configured for a core device.
 16. The methodof claim 14, wherein: the first and second isolation features includesilicon oxide; and the dielectric material layer includes silicon oxide.17. The method claim 14, further comprising: forming an implantationmask on the substrate, wherein the implantation mask covers the firstisolation feature and uncovers the second isolation feature; andperforming an ion implantation process to the substrate using theimplantation mask.
 18. The method of claim 14, further comprising:forming a polysilicon layer on the substrate; and patterning thepolysilicon layer to form a polysilicon resistor on the first isolationfeature and a polysilicon gate on one of the first and second activeregions.
 19. An integrated circuit, comprising: a semiconductorsubstrate; a first shallow trench isolation (STI) feature of a firstwidth and a second STI feature of a second width in a semiconductorsubstrate, the first width being substantially less than the secondwidth; a field-effect transistor (FET) disposed in an active region ofthe semiconductor substrate; and a resistor disposed on the second STIfeature; wherein the first STI feature includes an impurity of a firstdoping concentration substantially higher than a second dopingconcentration of the impurity in the second STI feature.
 20. Theintegrated circuit of claim 19, further comprising: a gate stackdisposed on an active region, wherein the gate stack and the resistorinclude polysilicon; a first field effect transistor (FET) for aninput/output (I/O) circuit, the first FET including a first gate oxidelayer of a first thickness; and a second FET for a core circuit, thesecond FET including a second gate oxide layer of a second thicknesssubstantially less than the first thickness; wherein the first andsecond STI features include silicon oxide.